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Proceedings of
International Conference on Advances in Computer Science and Electronics Engineering CSEE 2014
"MULTILEVEL SYSTEM FOR THERMAL DESIGN, CONTROL AND MANAGEMENT OF ELECTRONIC COMPONENTS"
I. A. KHARITONOV
K. O. PETROSYANTS
N.I. RYABOV
P.A. KOZYNKO
DOI
10.15224/978-1-63248-000-2-60
Pages
150 - 155
Authors
4
ISBN
978-1-63248-000-2
Abstract: “The methodology and software tools for multi-level thermal and electro-thermal design of electronic components are presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs and VLSIs; 3) Hybrid ICs, MCMs and PCBs. The actual test validation using IR thermal measurement is demonstrated for all types of components.”
Keywords: thermal design, heat conduction, semiconductor devices, circuits and VLSIs, PCBs, packages, IR temperature control.