CLASSIFICATION OF THIN FILM AND ULTRA THIN FILM DEPOSITION METODS
Published In: 5TH INTERNATIONAL CONFERENCE ON ADVANCES IN MECHANICAL AND ROBOTICS ENGINEERING
Author(s): BOEV B , D.ANGELOVA , KARTUNOV S.
Abstract: Classification of thin film deposition methods - deposition of thin films of semiconductor materials plays a major role in many areas, especially research and development.
- Publication Date: 28-May-2017
- DOI: 10.15224/978-1-63248-123-8-36
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FINITE ELEMENT ANALYSIS OF STUFFING-BOX PACKING SUBJECTED TO THERMO-MECHANICAL LOADS
Published In: 5TH INTERNATIONAL CONFERENCE ON ADVANCES IN MECHANICAL AND ROBOTICS ENGINEERING
Author(s): KAOUTAR BAHOUM , MOHAMMED DIANY , MUSTAPHA MABROUKI
Abstract: The principal rule for the stuffing-box packings is to ensure the stem valve sealing. The behavior of these systems is affected by the operating conditions, which are the gland axial stress, the temperature, and the fluid pressure, as well as the mechanical and geometrical characteristics of the various components. In this paper, a numerical study using finite element method is presented to analyze the stresses and the displacements in a stuffing box system under the gland stress and the temperature field.
- Publication Date: 28-May-2017
- DOI: 10.15224/978-1-63248-123-8-37
- Views: 0
- Downloads: 0